Asia Pacific Semiconductor Manufacturing Equipment Market Revenue Growth Predicted at 7% through 2026

The market study on Asia Pacific Semiconductor Manufacturing Equipment Market provides detailed analysis on this industry including substantial details subject to its overall position in the global landscape and applications across myriad end-user industries.

According to this report, the Asia Pacific semiconductor manufacturing equipment market was valued at USD 45 billion in 2019 and is further projected to record a valuation of USD 60 billion by 2026 while depicting a growth rate of 7% over 2020-2026. In line with this, the study also constitutes of crucial information on the current market scenario, developing technologies, widespread competitive landscape, strategies undertaken by market rivals, prospects, and vivid market segmentations.

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Moreover, details regarding growth rendering factors and ongoing technological trends that are expected to drive the overall Asia Pacific semiconductor manufacturing equipment industry have also been accurately drafted in the research report. The Asia Pacific semiconductor manufacturing equipment market has been potentially fragmented based on product, dimension, supply chain process, regions, and competitive landscape, whose in-depth study has also been covered in the report.

The assembly and packaging equipment segment will growth at a CAGR of over 6.0% in the Asia Pacific semiconductor manufacturing equipment market. The growth is majorly attributed to the proliferation of compact and advanced electronics devices including smartphones, wearables, tablets, among others. The manufacturers in the consumer electronics industry are inclined toward the integration of reduced node size semiconductors in advanced and compact devices, increasing the requirement for assembly and packaging equipment. The packaging equipment helps manufacturers to achieve low power consumption and high chip connectivity in advanced electronics devices. In September 2020, Apple Inc, announced the development of its new iPad Air equipped with A14 Bionic chip, based on TSMC 5nm EUV manufacturing process.

As per the given document, APAC semiconductor manufacturing equipment market has vividly been diversified into regions including China, Japan, South Korea, Taiwan. The report also includes substantial information on various factors that contribute to the overall market growth, trending growth opportunities, current and predicted CAGRs, technologies being used, robust presence of top-notch companies, regulatory reforms, and individual market share.

Japan holds significant growth opportunities in the Asia Pacific semiconductor manufacturing equipment market and will grow at a CAGR of around 4% during the forecast period. The growth is attributed to its highly competitive semiconductor material and equipment industry in the country. Japan is one of the major exporters of semiconductor manufacturing equipment in Asia Pacific. According to Korea International Trade Association, South Korea has imported 33.8% of its total semiconductor manufacturing equipment from Japan, in the first five months of 2019, accounting for USD 1.12 billion.

The semiconductor manufacturing equipment market in Asia Pacific is highly consolidated and claims the presence of prominent companies such as Advantest Corporation, Hitachi High-Tech Corporation, ULVAC, Inc., and Tokyo Electron Limited, among others. Additionally, the document drafted puts forth details on the sales spectrum of each of these firms, their market tactics to maintain strong foothold in the overall market, individual company profiles and market share, and their stance in the global ecosystem.

[TOC Chapters]

Chapter 4. Asia Pacific Semiconductor Manufacturing Equipment Market Share, By Product (USD)

4.1. Asia Pacific semiconductor manufacturing equipment market, by product, 2015-2026

4.2. Front-end equipment

4.2.1. Market estimates and forecast, 2015 - 2026

4.2.2. Lithography

4.2.2.1. Market estimates and forecast, 2015 - 2026

4.2.3. Polishing & grinding

4.2.3.1. Market estimates and forecast, 2015 - 2026

4.2.4. Water surface conditioning equipment

4.2.4.1. Market estimates and forecast, 2015 - 2026

4.2.5. Others

4.2.5.1. Market estimates and forecast, 2015 - 2026

4.3. Back-end equipment

4.3.1. Market estimates and forecast, 2015 - 2026

4.3.2. Wafer manufacturing equipment

4.3.2.1. Market estimates and forecast, 2015 - 2026

4.3.3. Assembly and packaging equipment

4.3.3.1. Market estimates and forecast, 2015 - 2026

4.3.4. Test equipment

4.3.4.1. Market estimates and forecast, 2015 - 2026

4.3.5. Others

4.3.5.1. Market estimates and forecast, 2015 - 2026

Chapter 5. Asia Pacific Semiconductor Manufacturing Equipment Market Size, By Dimension (USD)

5.1. Asia Pacific semiconductor manufacturing equipment market, by dimension, 2015-2026

5.2. 2D

5.2.1. Market estimates and forecast, 2015 - 2026

5.3. 2.5D

5.3.1. Market estimates and forecast, 2015 - 2026

5.4. 3D

5.4.1. Market estimates and forecast, 2015 - 2026

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