Molded Interconnect Devices (MID) Market Global Analysis and Forecasts By 2026

It has been estimated that global molded interconnect devices (MID) market size will be worth more than US$1 billion by 2026, with a positive application outlook in automotive, electronics, and industrial sector. Smartphones and smart wearables have gained immense popularity over the past decade. The deployment of MID into these gadgets helps improve circuit density and eliminate unnecessary components by combining circuit boards, cables, and connectors.

The greatest advantage of molded interconnect devices perhaps is the minimal environmental impact. This can be associated with the use of recyclable thermoplastic materials in MID and the elimination of harmful flame retardation manufacturing process.

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The LPKF-LDSTM technology is witnessing a rapid adoption across the globe. It provides a greater potential in terms of miniaturization and flexibility when modifying and improving functionality, particularly when implementing the features into several products. This can be observed in high volume of LPKF-LDSTM technology based internal antennas used in computers and smartphones.

The technology can help reduce the component count and cost significantly by including features such as a lamp holder, connector, or a wire harness in a device. In addition, it can be designed to be self-supporting, eliminating the need for additional mechanical components needed to support pc boards

In terms of the process, the molded interconnect devices (MID) market is segmented into 2-shot, LDS, and others. The others segment accounted for a more than 8% revenue share of the market in 2019 and is likely to grow further in the forthcoming years. These trends can be associated with the growing adoption of film insert molding which provides superior durability with scratch resistant hard coats.

The growing popularity of changeable phone covers is enabling molded interconnect devices to enhance the aesthetic appearance of smartphones on account of their flexibility. The increasing utilization of wireless smart devices is likely to enable the production of various new products where MIDs could play a critical role.

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Geographically, the Middle East and Africa region captured around 8% revenue share of the molded interconnect devices (MID) market in 2019 and is likely to experience a notable growth in the future. The regional trends can be associated with the rising adoption of smartphones, smart wearables, and other handheld devices.

BASF, Mitsubishi Engineering Plastics, Zeon Corporation, Evonik Industries, TE Connectivity, S2P smart plastic product, RTP Company, Multiple Dimensions AG, Molex, LPKF Laser & Electronics AG, and Amphenol T&M Antennas, are some of the prominent names in the molded interconnect devices (MID) market.

Major Key Points from Table of Content:

Chapter 4   Molded Interconnect Devices (MID) Market, By Process

4.1   Key trends by process

4.2   Laser Direct Structuring (LDS)

4.2.1    Molded interconnect devices (MID) market estimates and forecast, 2015 - 2026

4.2.2    Market estimates and forecast, by application, 2015 - 2026

4.3   Two-shot molding

4.3.1    Market estimates and forecast, 2015 - 2026

4.3.2    Market estimates and forecast, by application, 2015 - 2026

4.4   Others

4.4.1    Market estimates and forecast, 2015 - 2026

4.4.2    Market estimates and forecast, by application, 2015 - 2026

Chapter 5   Molded Interconnect Devices (MID) Market, By Application

5.1   Key trends by application

5.2   Automotive

5.2.1    Market estimates and forecast, 2015 - 2026

5.2.2    Market estimates and forecast, by process, 2015 - 2026

5.3   Consumer products

5.3.1    Market estimates and forecast, 2015 - 2026

5.3.2    Market estimates and forecast, by process, 2015 - 2026

5.4   Healthcare

5.4.1    Market estimates and forecast, 2015 - 2026

5.4.2    Market estimates and forecast, by process, 2015 - 2026

5.5   Industrial

5.5.1    Market estimates and forecast, 2015 - 2026

5.5.2    Market estimates and forecast, by process, 2015 - 2026

5.6   Military & aerospace

5.6.1    Market estimates and forecast, 2015 - 2026

5.6.2    Market estimates and forecast, by process, 2015 - 2026

5.7   Telecommunication & computing

5.7.1    Market estimates and forecast, 2015 - 2026

5.7.2    Market estimates and forecast, by process, 2015 - 2026

5.8   Others

5.8.1    Market estimates and forecast, 2015 - 2026

5.8.2    Market estimates and forecast, by process, 2015 - 2026

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Related News -   https://www.marketwatch.com/press-release/rat-model-market-top-trends-2021-2025-2021-06-16

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